Recommended Products and ServicesInformation for small lot sales of RELEASE FILM

Heat-resistant RELEASE FILM

Heat-resistant RELEASE FILM

Features

* Can be used in high temperature range around 200 degrees.
* Fits to any surface conditions.
* Silicone / Fluorine-free product.
* Transmits light in the ultraviolet range.
* Excellent balance between heat resistance and releasability.
* Due to its molecular structure, it is gas permeable.

Main applications

* PC-based coverlay press process
* Release film for pressing (CFRP, GFRP, AFRP, etc.)
* Cure prepreg of glass cloth, carbon fiber, aramid fiber, etc. and epoxy resin
* Release film for molding thermosetting resin

Processing is possible with specified Width / Length and cut products (A4 / Others). Prototype support, Small lot / Short delivery possible.

Name Thickness Processing Softening Temperature Tensile Strength
MD
Thermal dimension
Change rate MD
micron degrees Mpa %
Opulent (TPX) 50 gross 47, 52 30, 33 1.4, 1.6
50 mat 52 32 -0.6
120 mat 46 26 -1.6
150 gross 29, 42 19, 22 0.7, 1.0
150 mat 42 23 0
50 New product : Single-sided Ag (silver) vapor-deposited product
Name Thickness Width Chief Peeling force Residual adhesion rate
micro mm M g/50mm %
Silicon PET 12~ 1,120 12,000 10~50 90 and above
Negotiable Negotiable

* The above figures are not guaranteed values. It may not be used depending on the application.

High Heat-resistant FILM

High Heat-resistant FILM

Features

* Cost reduction is possible as an alternative to fluorine.
* High heat resistance (melting point : 247 degrees, Tg : over 200 degrees).
* Low dielectric (EpsilonGamma = 2.3, tanDelta = 0.0004 (10GHz)).
* Due to low water absorption, electrical characteristics do not change even in high humidity environments.
* Excellent hydrolysis resistance.
* Thickness : 12, 25, 35micro.

Main applications

* High frequency substrate
* Flat cable insulation

Processing is possible with specified Width / Length and cut products (A4 / Others). Prototype support, Small lot / Short delivery possible.

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